Assembly techniques

Before the assembly process is begun verify that all parts are present by examining the parts bags and comparing against the parts list. To speed the assembly process, examine and familiarise yourself with all parts in the kit so that identification will be readily accomplished. When capacitors and resistors are installed in the board ensure that they are seated flush against the board. Then bend out the leads slightly to prevent them from falling out when soldering. After soldering, clip off any excess lead lengths.

A major cause of kit malfunctions is improper soldering. Another is improper component
location. Be sure you have the right part in the right place. Pay particular attention to the
polarity on electrolytic capacitors, diodes, transistors and other semiconductor devices.

Apply only enough heat and solder to make a good mechanical and electrical bond. Too much solder can cause solder bridges between adjacent foil areas on the p.c. (printed circuit) board. You will notice a green (or other colour) solder mask has been applied to the board to prevent this.

It is recommended that a 25 to 40 watt soldering iron be used with a tip small enough to allow easy soldering to the small IC pads but not so small that heat is not retained for soldering the larger parts. When solder is applied to a component, be sure that the heat is simultaneously applied to both the component lead and the component pad on the PC board so that good solder flow will occur. Be sure that after the soldering operation is conplete that the lead extends through the solder smoothly, indicating a good solder joint. Do not ever blob the solder over the lead because this can result in a cold solder joint.

After the entire PC board is assembled, and prior to installing the board in the case (if the kit includes one), it is recommended that a solvent be used to clean the flux off the solder side of the printed circuit board. This will prevent any dirt from accumulating and shortening the life of your completed instrument. When applying solvent, be sure that you hold the board such that no solvent is allowed to enter any IC sockets, trimpots or switch assemblies. In addition to the parts supplied with the kit, the following are required to complete assembly: Rosin core solder, flux remover solvent and epoxy glue.